Strong of the success of his Bonding Machines, CEDATEC srl has introduced in the market the most advanced multilayer registration technology called PINLESS. It adopts a CCD Optical feature along with the new Thermal Bonding System (TBS) providing several advantages such as:

• No limits on layers number.
• No need for post etching punching/drilling layer.
• No need for dedicated tools for inner layers registration and lamination press thus less manpower.
• Eliminates all the mechanical tolerances related to the pin-lam system.
• Welding up to 8 mm multilayer thick.
• Welding up to 8 mm multilayer thick.
• Very tight layer to layer registration accuracy of +/- 20 µm (+/- 0.75 mil).
• Small machine footprint.