Specially designed for any today needs, Cedatec has developed the NEW GENERATION Vacuum-Lamination-Press VLP 7300 that combines the revolutionary endothermic system for heating up the material along with the innovative heating element technology for keeping top and bottom material temperature uniform.
The pressure is applied by an air-booster system which guarantees a perfect material thickness and planarity.
Heating profile, Pressure, Vacuum and all other lamination process are controlled by the most advanced interface by Smart software and Touch-Screen.
Historical cycles data can be stored on the computer or network.
Material quality improvement is evident same as well the cost saving which allows the VLP 7300HL to be the most advanced Press in the market.

• CCL and PCB full sheet size
• High productivity
• High dimensional stability
• Very tight temperature accuracy
• Small footprint
• Maintenance friendly
• Material cost savings
• ENERGY SAVING

New Software platform Cedatec System© with centralized data-collection (Industry 4.0 complies)